Reliability of Microelectronic Interconnections: The Microstructure Matters!

(34:48 + Q&A) Prof. Abhijit Dasgupta, University of Maryland
From the 2024 IEEE Symposium on Reliability for Electronics and Photonics Packaging
Summary: Heterogeneous integration of microelectronics has led to continuous shrinking of interconnection geometries. The length scales of such interconnection structures are now comparable to the microstructural features of the interconnection material itself. In such situations...
Bio: Abhijit Dasgupta is Professor of Mechanical Engineering at University of Maryland, College Park. He conducts his research on the mechanics of engineered, heterogeneous, active materials, with special emphasis on the micromechanics of constitutive and damage behavior.  He applies his expertise to several multifunctional material systems. His research contributions include solution techniques for coupled boundary value problems in multifunctional particulate and laminated composites, micromechanics approaches for constitutive properties of advanced 3-D composites, dynamic behavior and failure of thick composites, micromechanics of fatigue damage in viscoplastic eutectic-alloy composites and in short-fiber polymeric composites, and self-health monitoring in “smart” systems.  He applies these principles for developing effective virtual qualification tools, for optimizing manufacturing process windows, for real-time health monitoring and for devising quantitative accelerated testing strategies used in qualification and quality assurance of complex electronic, electromechanical and structural systems.  He has published over 150 journal articles and conference papers on these topics, presented over 20 short workshops nationally and internationally, served on the editorial boards of three different international journals, organized several national and international conferences, and received six awards for his contributions in materials engineering research and education.

For additional talks from this REPP, or earlier ones, please visit https://attend.ieee.org/repp