Tutorial: Achieving High Reliability for Lead-Free Solder Joints: Materials Considerations

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(1:43:38) Ning-Chen Lee, Indium Corp. 

This course covers the detailed material considerations required for achieving high reliability for lead-free solder joints, including joint mechanical properties, development of type and extent of intermetallic compounds (IMC) under a variety of material combinations and aging conditions and how those IMCs affect the reliability. The failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history are addressed in detail, and novel alloys with high reliability and reduced fragility will be presented.

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(1:43:38) Ning-Chen Lee, Indium Corp.  This Tutorial was prepared for the REPP'21 Symposium.  This course covers the detailed material considerations required for achieving high reliability for lead-free solder joints, including joint mechanical properties, development of type and extent of intermetallic compounds (IMC) under a variety of material combinations....

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