Tutorial: Achieving High Reliability for Lead-Free Solder Joints: Materials Considerations

56 views
Download
  • Share
Create Account or Sign In to post comments
#solders #reliability #lead-free

(1:43:38) Ning-Chen Lee, Indium Corp. 

This course covers the detailed material considerations required for achieving high reliability for lead-free solder joints, including joint mechanical properties, development of type and extent of intermetallic compounds (IMC) under a variety of material combinations and aging conditions and how those IMCs affect the reliability. The failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history are addressed in detail, and novel alloys with high reliability and reduced fragility will be presented.

Please visit our REPP Symposium website and sign up for our IEEE ListServ Dlist: https://attend.ieee.org/repp/

(1:43:38) Ning-Chen Lee, Indium Corp.  This Tutorial was prepared for the REPP'21 Symposium.  This course covers the detailed material considerations required for achieving high reliability for lead-free solder joints, including joint mechanical properties, development of type and extent of intermetallic compounds (IMC) under a variety of material combinations....

Speakers in this video

Advertisment

Advertisment