Reimagining Co-design of HPC Systems for a Heterogeneous Future

32 views
Download
  • Share
#advanced packaging #heterogeneous integration #5G #photonics #3D integration #thermal #test #new materials #SiP #2.5D #high performance computing

-- architectural specialization, software, algorithms, accelerators, disruptive changes ... Presentation from the 2021 IEEE Heterogeneous Integration Roadmap Symposium by John Shalf, NERSC CTO, Lawrence Berkeley National Laboratory.

The Fourth Annual Heterogeneous Integration Roadmap Symposium and Annual Meeting, held in Silicon Valley in February 2021, was sponsored by three IEEE Societies (EDS, EPS, and Photonics), as well as ASME and SEMI.

The HIR is 600+ pages of details across all areas of advanced electronics packaging, covering pre-competitive information for industry, working engineers, and academia.

The Roadmap is available without charge. Access videos at https://ieee-region6.org/scv-eps/?p=2416.

This presentation introduces the Roadmap and discusses the annual updates.

-- architectural specialization, software, algorithms, accelerators, disruptive changes ... Presentation from the 2021 IEEE Heterogeneous Integration Roadmap Symposium by John Shalf, NERSC CTO, Lawrence Berkeley National Laboratory.

Speakers in this video

Advertisment

Advertisment