The Future of Microelectronics After the Pandemic

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#advanced packaging #heterogeneous integration #5G #photonics #3D integration #thermal #test #new materials #SiP #2.5D

-- industry update, supply chain interdependency, geopolitics, government support, HIR developments ... Presentation by Ajit Manocha, President and CEO, SEMI, from the 2021 IEEE Heterogeneous Integration Roadmap Symposium.

The Fourth Annual Heterogeneous Integration Roadmap Symposium and Annual Meeting, held in Silicon Valley in February 2021, was sponsored by three IEEE Societies (EDS, EPS, and Photonics), as well as ASME and SEMI.

The HIR is 600+ pages of details across all areas of advanced electronics packaging, covering pre-competitive information for industry, working engineers, and academia.

The Roadmap is available without charge. Access videos at https://ieee-region6.org/scv-eps/?p=2416.

This presentation introduces the Roadmap and discusses the annual updates.

-- industry update, supply chain interdependency, geopolitics, government support, HIR developments ... Presentation by Ajit Manocha, President and CEO, SEMI, from the 2021 IEEE Heterogeneous Integration Roadmap Symposium.

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