Working Group Meeting 3: 2021 IEEE Heterogeneous Integration Roadmap

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#IoT #advanced packaging #heterogeneous integration #5G #photonics #3D integration #thermal #test #new materials #SiP #2.5D

Presentation from the 2021 IEEE Heterogeneous Integration Roadmap Symposium, with talks/discussion on 5G, RF and Analog Mixed Signal; Mobile; Aerospace & Defense; Wafer-Level Packaging; Materials & Emerging Research Materials; Internet of Things (IoT).

The Fourth Annual Heterogeneous Integration Roadmap Symposium and Annual Meeting, held in Silicon Valley in February 2021, was sponsored by three IEEE Societies (EDS, EPS, and Photonics), as well as ASME and SEMI.

The HIR is 600+ pages of details across all areas of advanced electronics packaging, covering pre-competitive information for industry, working engineers, and academia.

The Roadmap is available without charge. Access videos at https://ieee-region6.org/scv-eps/?p=2416.

Presentation from the 2021 IEEE Heterogeneous Integration Roadmap Symposium, with talks/discussion on 5G, RF and Analog Mixed Signal; Mobile; Aerospace & Defense; Wafer-Level Packaging; Materials & Emerging Research Materials; Internet of Things (IoT).

Speakers in this video

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