Wrap-up and Charge to Heterogeneous Integration Roadmap Teams

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#advanced packaging #heterogeneous integration #5G #photonics #3D integration #thermal #test #new materials #SiP #2.5D

The Fourth Annual Heterogeneous Integration Roadmap Symposium and Annual Meeting, held in Silicon Valley in February 2021, was sponsored by three IEEE Societies (EDS, EPS, and Photonics), as well as ASME and SEMI. The HIR is 600+ pages of details across all areas of advanced electronics packaging, covering pre-competitive information for industry, working engineers, and academia. The Roadmap is available without charge.   
    Information about the IEEE Heterogeneous Integration Roadmap is available at https://eps.ieee.org/hir.  Other HIR Symposium videos can be accessed at https://ieee-region6.org/scv-eps/?p=2416

Nicky Lu, CEO and Chairman, Etron Technology - Presentation from the 2021 IEEE Heterogeneous Integration Roadmap Symposium. 

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