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APEC 2015: 3D Packaging

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Brian Narveson, PSMA Packaging Committee Co-Chairman, previews the 3D packaging technology report entitiled "Current Developments in 3D Packaging With Focus on Embedded Substrate Technologies"

Brian Narveson, PSMA Packaging Committee Co-Chairman, previews the 3D packaging technology report entitiled "Current Developments in 3D Packaging With Focus on Embedded Substrate Technologies"

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