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IMS 2012 Microapps - Electrical Thermal Coupled Solutions for Flip Chip Designs

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IMS 2012 MicroApps presents "Electrical Thermal Coupled Solutions for Flip Chip Designs," by John Fiala and Mike Heimlich.

IMS 2012 MicroApps presents "Electrical Thermal Coupled Solutions for Flip Chip Designs," by John Fiala and Mike Heimlich.

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