Cart
Create Account
Sign In
Streamed Live from IMS Montreal: Qualcomm's Steve Mollenkopf - "3G/4G Chipsets and the Mobile Data Explosion"
Streamed Live from IMS Montreal:
Plenary Session Featuring Steve Mollenkopf:
3G/4G Chipsets and the Mobile Data Explosion
Watch on your Mobile Device!
The rapid growth of wireless data and complexity of 3G and 4G chipsets drives new design and deployment challenges for radio and device manufacturers along with carriers. The increase in device and network complexity will result in significant business opportunities for the industry. This talk will provide a perspective on the opportunities and challenges from the point of view of a large, worldwide manufacturer of semiconductors and technology for cellular and connected consumer electronics devices.
Presented by Steve Mollenkopf, President and Chief Operating Officer of Qualcomm, the plenary talk will feature Steve's unique insights drawn from his broad based career. From his leadership role in Qualcomm, one of the greatest and most successful global telecommunication corporations, as well as pioneer of Code Division Multiple Access (CDMA) technology, Mr. Mollenkopf is ideally positioned to provide an acute and authoritative perspective on microwave technology and business which should be in the interest of all the attendees of the IMS. His talk will be entitled “3G/4G chipsets and the mobile data explosion.”
Add to Calendar link
Speaker Bio
Steve Mollenkopf serves as president and chief operating officer of Qualcomm, leading the company’s business operations, product and worldwide sales groups. In this role, Mr. Mollenkopf also serves as president of Qualcomm CDMA Technologies (QCT). Moreover, he is a member of Qualcomm’s Executive Committee, helping to drive Qualcomm’s overall global strategy.
Since 2008, Mr. Mollenkopf led QCT and served as executive vice president and group president of Qualcomm, driving growth and providing critical technical and operational leadership. QCT, the company’s semiconductor business, is the world’s largest wireless chip supplier and fabless semiconductor company, in terms of revenue.
A published IEEE author, Mr. Mollenkopf holds patents in areas such as power estimation and measurement, multi-standard transmitter system and wireless communication transceiver technology. He serves on the Board of Directors for the Semiconductor Industry Association and serves as a Board Member and is on the Board Executive Committee and CEO Council for the Global Semiconductor Alliance.
Mr. Mollenkopf holds two electrical engineering degrees, a bachelor of science in electrical engineering from Virginia Tech and a master of science in electrical engineering from the University of Michigan at Ann Arbor
Be sure to visit the "Most Popular Questions" tab and vote.