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Heterogeneous Photonic Packaging - John Osenbach - IPC 2018

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#IEEE #IPC #2018 #photonics #conference #industry #business #Industry Day #sessions #packaging #design #manufacturing #profitability #electrical requirements #thermal requirements #products #devices #new materials #technology

John Osenbach, Infinera Corporation, discusses photonics packaging from an industry perspective, especially geared toward manufacturing and making profits. Osenbach gives an overview of drivers, InP- or Si-Photonics, photonics packaging needs, and solutions, as well as future trends.

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