APEC 2013 Power Up!

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IEEE Power Electronics Society

IEEE Industry Applications Society

2-SID-3 Conference Highlights Series

11-All Programs Series

13-Public Videos

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APEC 2013 continues the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronics engineer.

Here's a quick look at the excitement of APEC 2013, which continues the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronics engineer.

March 20, 2013

Next Up

00:56:26

Using Predictive Engineering for Multiple Response Optimization of an IC

00:55:57

Thermal Challenges and Opportunities: From Chip to Facility

00:47:36

Advanced X-ray Imaging Technologies for Heterogeneous 3D IC Package Metrology and Inspection

00:54:12

2.5D Silicon Photonics Interposer Flip Chip Attach

01:46:43

Blockchain Innovations: AI Integration and Security Trust (2 talks)

00:53:40

Chemical Mechanical Polishing (CMP) for Hybrid Bonding