Enabling Advanced Chiplet-Based Design

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#Hybrid bonding #advanced packaging #metrology #2.5D #3D #die stacking #Cu-Cu

(27:57 + Q&A) Brandon Wang, Synopsis
From the First IEEE Hybrid Bonding Symposium 
Summary: The talk will cover the challenges in chiplet design, and dive deep to design enablement, implementation methods, and holistic analysis. The talk will address the possibilities of paradigm shift in compute architecture using chiplet technologies, demonstrated in real use cases.
Bio: Brandon Wang is Vice President of Technology Strategy in the Office of the CEO at Synopsys. Brandon oversees corporate-level technology roadmaps and strategies for growth, including global strategic and ecosystem partnerships, and M&A/investments for new horizons. He also heads the Chief Innovation Office, championing organic innovations and worldwide academic and research partnerships. Prior to joining Synopsys in 2018, Brandon served executive and senior roles at Cadence, ARM, Qualcomm, and Lattice in chief strategy office, product marketing, and R&D organizations for over two decades. Brandon is currently serving at the board of Efabless corporation, and as a limited partner/Investment Council member to Imec.Xpand, an affiliated VC to Imec. He is also a Limited Partner to AIX, a leading venture capital firm focusing on AI investment. An Electrical and Computer Engineer by training, Brandon holds 10 patents, and has published at 20+ IEEE conferences, in journal papers and invited talks in the areas of 3D-IC, Machine Learning, HW security, High-speed Interfaces, Low Power CPU, FPGA and Memory Designs. He also has an MBA degree from the Wharton School at the University of Pennsylvania.

For other edited  videos from this symposium, visit  https://attend.ieee.org/hbs/?page_id=456
 

(27:57 + Q&A) Brandon Wang, Synopsis
From the First IEEE Hybrid Bonding Symposium 
Summary: The talk will cover the challenges in chiplet design, and dive deep to design enablement, implementation methods, and holistic analysis. The talk will address the possibilities of paradigm shift in compute architecture using chiplet technologies, demonstrated in real use cases....
 

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