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01:19:53
The Origins of Silicon Valley: Characteristics of a Startup Environment
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00:03:12
IEEE Silicon Valley Electronics Packaging Chapter: Intro to our AdCom (2026)
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00:58:45
Co-Packaged Optical Transceivers for HPC, Data Center and AI Applications
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00:48:22
Dual Seed Semi-Additive and Damascene Processes: Enabling Fine-Pitch Interconnects for Advanced Packaging
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00:44:56
Semiconductor Supply Chain Decarbonization - IEEE SusTech 2025
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01:02:16
Silicon Photonics Qualification and Reliability Requirements
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00:48:47
Biodegradable Electronics in the Semiconductor Era
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01:02:05
Power Distribution in Heterogeneous Integrated Packaging for Data Center Computing
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00:28:24
X-ray Imaging Breakthroughs for Hybrid Bonding Inspection
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00:29:31
Role Of X-Ray Technologies In Device Reliability: From Wafer to Package
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00:29:18
Novel Metrology for Experimentally Visualizing Hybrid Bonding Induced Thermal Stress
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00:30:16
AI-Enhanced Multimodal Approaches for Electronics Metrology
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00:31:09
YAP-1.1: Layout-Aware Yield Prediction for 3D Hybrid Bonding
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00:35:21
Multiscale Simulation Framework for Predicting Cu-Cu and SiO2-SiO2 Hybrid Bond Quality in Semiconductor Packaging
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00:33:52
Detection of Physical Damage in Advanced Packaging Interconnects
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00:24:04
Electromigration Behavior of Hybrid Bonded Cu-Microbumps: Effect of Dielectric, Metal and Interface Properties
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00:29:48
The Impact of Hybrid Bonding on Testing 3D-Stacked Dies
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00:31:29
Reliability and Yield for Die-to-Wafer Hybrid Bonded 8-High Stacks with TSV
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00:23:03
Feasibility of the Surface Activated Bonding for Hybrid Bonding and its Alternatives
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00:38:29
From Interface Chemistry to Bond Wave: Unraveling SiCN/Cu Bonding Mechanisms
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00:31:52
CMP and Hybrid Bonding – Eternal Love or Toxic Relation?
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00:37:55
Sub 100nm Die-to-Wafer Hybrid Bonding Drives Foundry 2.0
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00:36:15
Wafer-to-wafer Bonding Overlay: Co-Optimization with Lithography and Hidden Patterns
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