1. Home
  2. Channels
  3. IEEE Electronics Packaging Society
IEEE Electronics Packaging Society
To enjoy the benefits of IEEE:

Join / Renew Today

Blazing the Trail to the Information Age: 75th Anniversary of the Transistor
IEEE MEMBER BENEFITS
Celebration of World Engineering Day: IEEE 2022 President, Ray Liu
How to Get the Most Out of Your IEEE Membership
Imagine Life With an Open Grid
Biomagnetics-using magnetic fields to precisely excise cancer
Connecting Your Inner Engineer With Your Inner Leader - Jelena Kovačević - IEEE WIE
Demystifying the UN-Sustainable Development Goals (SDGs)
Entrepreneurship in IoT - 2021 IoT World Forum
Scalable Highly-Integrated Photonics Packaging for the 5G World: From Datacenters to Drones
IEEEXtreme 14.0 Winner's Circle
IEEE Member Experience - Profiles
IEEE Photonics Society Awards 2020
2020 IEEE Noble Award

Advertisement

All videos
Education

Advertisement

Showing 1 - 1 of 1
01:19:53
The Origins of Silicon Valley: Characteristics of a Startup Environment
14 views
Showing 1 - 1 of 1
Showing 1 - 22 of 129
00:13:51
Challenges and Recent Perspectives of 3D Heterogeneous Integration
65 views
>
00:13:40
Grain Orientation, Microstructure Evolution and Fatigue Life Prediction of Solder Joints under Thermal Shock Test for Fan-out Wafer Level Packaging
20 views
>
00:37:36
Thermal and Failure Analysis of Advanced Microelectronic Devices
32 views
>
00:39:52
Quality and Reliability Assessment of Sintered Nanoporous-Copper Interconnects on Substrates
15 views
>
00:19:39
Thermal Oscillations and Reliability for Capillary-driven Boiling in Microporous Wicks
5 views
>
00:20:31
Numerical Investigation of Impinging Surface Enhancement with Copper Inverse Opals (CIO) for Jet Cooling
13 views
>
00:41:32
Interconnect Reliability: From the Chip to the System
30 views
>
00:48:02
Reliability Outlook and Challenges for Monolithic SiPh Applications in Foundary Viewpoint
22 views
>
00:25:38
Failure-Oriented-Accelerated-Tests (FOATs) and their Roles in Making a Viable IC Package into a Reliable Product
3 views
>
00:23:00
Multiphysics Approach to Reliability Prediction of Integrated Circuits Due to Radiation Induced Failures
10 views
>
00:26:30
Mars 2020 Perseverance Rover: Thermal Cycle Life Qualification
2 views
>
00:33:09
Test technologies for Ensuring Quality and Reliability
7 views
>
00:21:06
FE-Modeling Validation of Innolot Deformation Behavior with TMF Testing under Cyclic Shear-Dominant Thermomechanical Loading
4 views
>
00:22:55
Addressing Thermal Challenges for Co-packaging Processes on Glass Substrates
9 views
>
00:40:08
Low Melting Temperature Solder Interconnect Thermo-mechanical Performance, Stability, and Degradation Mechanism
10 views
>
00:48:01
Reliability Challenges of Advanced Silicon Photonics Devices
19 views
>
00:26:09
Heterogeneous Integration Roadmap Update: Chapter on Photonics Packaging
134 views
>
00:39:38
Heterogeneous Integration Roadmap Update: Chapter on Reliability
20 views
>
00:40:42
A Study of Thermal Analysis Modeling Method for Press-pack IGBT Modules Considering Contact Surface Damage
10 views
>
00:14:01
Thermomechanical Modeling and Reliability Analysis of Copper Inverse Opals (CIO) Structure for Capillary-Fed Boiling
13 views
>
00:25:22
Warpage Characterization of the Direct Bonded Copper (DBC) for 3D Manifold Microchannel Cooler Fabrication and Integration
6 views
>
00:24:27
Baking Time Study for Moisture-Sensitive Packages
12 views
>
Showing 1 - 22 of 129

Advertisement