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01:19:53
The Origins of Silicon Valley: Characteristics of a Startup Environment
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Showing 1 - 22 of 97
00:34:43
Overview of Co-Design of Electronics Systems, and NSF Proposal Review
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00:55:02
The Future of Hardware Technologies for Computing: N3XT 3D MOSAIC, Illusion Scaleup, Co-Design
41 views
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01:01:41
A 3D Heterogenous Integration Future: Enabling Continued Scaling of Electronics Systems
136 views
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00:56:52
Semiconductor Packaging Technology: The Future Is Now
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00:57:33
Flexing, Bending And Stretching Toward Advances In Electronics For Medical And Industrial Applications
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01:05:33
Challenges and Innovations in Microprocessor Power Delivery
139 views
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00:58:10
Electrical Design Of Advanced Packaging In Computing Systems
41 views
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00:48:25
Understanding Your Supply Chain: What Is Hiding There
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00:54:45
Counterfeit And Fraudulent Parts And Materials: Is the Current Status the New Normal?
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00:59:35
Advanced Packaging In Hyperscale Data Center Applications
148 views
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00:31:15
Data Centers At Meta: Heterogeneous Integration Driven By AI/ML And Network Applications
72 views
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00:57:59
Semiconductor Packaging: The Future Is Now
238 views
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01:24:49
Recent Advances And Trends In Advanced Packaging
376 views
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00:54:41
To Chiplet or Not To Chiplet: Heterogeneous Integration and Chiplets
161 views
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00:51:29
Sustainable Alternative Materials to Plastics in Electronics
39 views
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00:58:57
The HAXPES-Lab: How It Works And What It Can Do For The Electronics Industry
91 views
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01:05:52
Heterogeneous Integration, Group 4: Working Group Presentations, Discussion
32 views
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00:36:22
3D Heterogeneous Integration (HI): An Enabler for Next Generation Systems
136 views
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01:03:36
Panel: SiP and Module for Automotive Applications for Heterogeneous Integration
54 views
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01:06:02
Heterogeneous Integration, Group 3: Working Group Presentations, Discussion
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01:15:04
Integrated Photonics, Heterogeneous Integration, and AIM Photonics Prototyping
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01:23:13
Panel: Architecture and Co-Design for Heterogeneous Integration
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