Hybrid Bonding Innovations: Ultra-Low-Temperature Cu-Cu Bonding Based Passivation Technology and HRDL Platform Development for REL Interposer Applications

(27:53 + Q&A) Prof. Kuan-Neng Chen, Institute of Electronics, National Yang Ming Chiao Tung University (NYCU)
From the First IEEE Hybrid Bonding Symposium 
Summary: Hybrid bonding has emerged as a key technology in advanced packaging, offering high-density integration and enhanced electrical performance. This presentation will introduce two significant advancements in hybrid bonding. The first part is an ultra-low temperature Cu-Cu hybrid bonding using passivation technology. The integration of passivation technology enables Cu-Cu bonding at very lower temperatures, which is crucial for minimizing thermal stress and ensuring compatibility with low thermal budget applications. We will delve into the mechanisms of passivation, the results of bond quality and performance, and the implications for fine-pitch applications. The second part is a novel Hyper RDL (HRDL) platform based on hybrid bonding for RDL interposer applications. The development of HRDL platform leverages hybrid bonding to create a low warpage, high IO, and high reliability RDL interposer solution for advanced packaging. We will discuss the design, fabrication process, and performance benefits of the HRDL platform, demonstrating how it meets the demands of next-generation advanced packaging applications. By examining these two aspects, the presentation aims to provide a comprehensive understanding of how hybrid bonding is shaping the future of advanced interconnect technologies.
Bio: Dr. Kuan-Neng Chen is a Chair Professor at the Institute of Electronics at the National Yang Ming Chiao Tung University (NYCU) in Taiwan. He received his Ph.D. degree in Electrical Engineering and Computer Science, as well as his M.S. degree in Materials Science and Engineering, both from the Massachusetts Institute of Technology (MIT). Dr. Chen has held several prominent positions including Vice President for International Affairs and Associate Dean of the International College of Semiconductor Technology at NYCU, Program Director of the Micro-Electronics Program at the National Science and Technology Council in Taiwan, and Research Staff Member at the IBM Thomas J. Watson Research Center. Dr. Chen has received numerous awards and honors throughout his career, including the IEEE EPS Exceptional Technical Achievement Award, the IMAPS William D. Ashmon – John A. Wagnon Technical Achievement Award, the National Industrial Innovation Award, the MOST/NSTC Outstanding Research Award (twice), the MOST/NSTC Futuristic Breakthrough Technology Award (twice), the Pan Wen Yuan Foundation Outstanding Research Award, the CIE Outstanding Professor Award, the CIEE Outstanding Professor Award, and the IBM Invention Achievement Awards (5 times). He is the author of over 400 publications, including 3 books and 7 book chapters, and holds 87 patents. Dr. Chen has also served as a Guest Editor for the MRS Bulletin and IEEE Transactions on Components, Packaging, and Manufacturing Technology, and has held leadership roles in various conferences and committees, such as IEEE IITC General Chair. Dr. Chen is a Fellow of National Academy of Inventors (NAI), IEEE, IET, and IMAPS, and a member of Phi Tau Phi Scholastic Honor Society. Additionally, Dr. Chen holds the position of Specially Appointed Professor at the Tokyo Institute of Technology (Tokyo Tech) and serves as an Adjunct R&D Director at the Industrial Technology and Research Institute (ITRI). His current research interests focus on three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.

For other edited  videos from this symposium, visit  https://attend.ieee.org/hbs/?page_id=456