EMC - Li Er-ping - Advanced Electromagnetic Simulation Techniques for Analysis of Signal and Power Integrity in Multilayered Electronic Packaging

This presentation will review the advancements of computational electromagnetics with applications in complex 3-dimensional electronics package integration, and address the challenges in system-level signal and power integrity and electromagnetic interference analysis.
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  • IEEE Student MemberUS $29.00
  • Non-IEEE MemberUS $39.00

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