The collection of educational videos is presented by the IEEE Electromagnetic Compatibility Society (EMC). EMC members enjoy free access to these videos. To learn more about EMC membership, please visit http://www.emcs.org/membership_main.html
The IEEE Electromagnetic Compatibility Society is the world's largest organization dedicated to the development and distribution of information, tools and techniques for reducing electromagnetic interference.
This collection of videos consist of a variety of lectures and instructional tutorials that the IEEE EMC society has sponsored over the years. All of the videos in this collection are considered to contain valuable information that members and non-members of the EMC society may find useful and informational.
The society's field of interest includes standards, measurement techniques and test procedures, instrumentation, equipment and systems characteristics, interference control techniques and components, education, computational analysis, and spectrum management, along with scientific, technical, industrial, professional or other activities that contribute to this field.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Tzong-Lin Wu - Signal integrity simulation and equivalent circuit modeling
In this talk, a case study about a TFT driver board for establishing a SI simulation in SPICE environment is first presented. The importance of the SPICE-based model for the discontinuities (or transitions), such as via, bends, BGA balls, etc., in signal path will be highlighted. A general time-domain approach for synthesizing the equivalent macro-models for those discontinuities will be finally proposed.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Joungho Kim - Signal integrity of TSV-based 3D IC
In this presentation, we will discuss signal integrity design methodologies and approaches to solve signal integrity design issues. Finally, we will propose future TSV and interposer architectures for the TB/s scale data-bandwidth.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Eric Bogatin - The Three Most Confusing Principles In Signal Integrity And How Not To Be Confused
In this lecture we look at three concepts at the heart of signal integrity problems: inductance, characteristic impedance and differential impedance. We look at why they are confusing and then the right way of using the terms to help feed our engineering intuition to help us solve signal integrity problems. The words we use often affect our intuition and how we think about concepts. In signal integrity we use some words either incorrectly or ambiguously and this confuses our intuition. In this lecture we look at three concepts at the heart of signal integrity problems: inductance, characteristic impedance and differential impedance. In this talk, Eric Bogatin?looks at why they are confusing and then the right way of using the terms to help feed our engineering intuition to help us solve signal integrity problems.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Sam Connor - Differential signaling is the opiate of the masses
This talk will discuss the drawbacks differential signaling and raises the concern that their proliferation brings a false sense of security.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Ji Chen - EMC/EMI Issues in Biomedical Research
In this talk, we will present some recent investigations on the EMC/EMI issues related to scenarios where the interactions between electromagnetic signals and biomedical systems lead to safety considerations for medical devices and patients.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Ram Achar - Demystifying the Signal Integrity Challenges in High-Speed Designs
With the increasing demands for higher signal speeds coupled with the need for decreasing feature sizes, signal integrity effects such as delay, distortion, reflections, crosstalk, ground bounce and electromagnetic interference have become the dominant factors limiting the performance of high-speed systems. This lecture provides a comprehensive approach for understanding the multidisciplinary problem of signal integrity: issues/modeling/analysis in high-speed designs.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Ji Chen - Design/Modeling for Periodic Nano Structures for EMC/EMI
In this talk, we shall review some new development in periodic structures, such as spectral FDTD for periodic structure modeling, the array-scanning-method (ASM) FDTD modeling of the interactions between finite-sized electromagnetic and periodic structures, and the effective electrical parameters extraction for composite material using these techniques.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Scott Piper - Verifying Simulation Results with Measurements
When results of EMC simulations are presented, there are many who ask for evidence supporting the results in the form of "real world" data. The term "real world" data is typically referring to measurements performed in a laboratory but there are strengths and weaknesses in measurements just as there are in simulation methods. The good news is that measurements and simulations do not have many weaknesses in common making it possible to use simulations and measurements together to get closer to the "real" data everyone is looking for.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Li Er-ping - Advanced Electromagnetic Simulation Techniques for Analysis of Signal and Power Integrity in Multilayered Electronic Packaging
This presentation will review the advancements of computational electromagnetics with applications in complex 3-dimensional electronics package integration, and address the challenges in system-level signal and power integrity and electromagnetic interference analysis.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Scott Piper - I Wish I Knew about Numerical Modeling for EMC when I First Started
Scott shares his experience about getting started with numerical modeling for EMC in a product engineering setting. This presentation is useful to someone interested in getting started with EMC modeling but those with EMC modeling experience can relate to this discussion as well.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Joungho Kim - Power Integrity of SiP (System in Package)
In this talk, new modeling, design, and analysis approaches will be introduced with the consideration of power integrity. The unique methods are based on simultaneous and hierarchical chip-packaging, co-design and modeling in order to offer cost effective design solutions.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Chris Holloway - Metamaterials and Metafilms: Overview and Applications
In this talk, we will introduce and summarize metamaterials theory and applications. We will also show that the effective permeability and permittivity of composite medium consisting of insulating magneto-dielectric spherical particles embedded in a background can be simultaneously negative for wavelengths where the spherical inclusions are resonant to form a double negative (DNG) material.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Chris Holloway - Propagation and Detection of Signals Before, During, and After a Building Collapse
In this presentation, we will summarize three experiments related to homeland security problems for first-responders (firefighters and police) in disaster situations (i.e., collapsed buildings). The experiments investigate various schemes for locating firefighters and civilians who may have portable radios or cell phones and are trapped in voids in the collapsed building.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Chuck Bunting - Radiative EMC Testing Using Reverberation Chambers
This talk will discuss the potential benefits of EMC testing in a reverberation chamber.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Eric Bogatin - The Ten Habits of Highly Successful Board Designers
By leveraging just ten design habits described in this lecture, any engineer can dramatically improve the signal integrity performance of their high speed products.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Bruce Archambeault - The 'Ground' Myth
The most misunderstood and misused term in electrical engineering is the term ?Ground?. Understanding where the return current will flow is one of the most important EMC design issues, and can not be left to simply ?return on ground?. This talk will discuss the various considerations for the return current and the true meaning of ?ground?.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Bruce Archambeault - Effective Power/Ground Plane Decoupling for PCB
Printed Circuit Boards (PCBs) use a variety of decoupling capacitors to reduce the noise between power and ground-reference planes. There are many myths and conflicting design recommendations. This talk will look behind some of the conflicting recommendations and show what the correct design direction will be most effective.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Bruce Archambeault - Inductance and Partial Inductance: What's It All Mean?
This presentations talks about inductance, one of the most important concepts from an EMC point of view because it dominates how high data rate return current will flow. Understanding that the path of the current is more important than conductor size is an important concept in the reducing of inductance.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Li Er-Ping - Signal integrity and EMI in high speed electronics
In this presentation, we will discuss the fundamental design principles and challenges to achieve the low noise power distribution network, and the return current path by applying the concepts of the chip, package, and PCB PDN co-design.
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Tzong-Lin Wu - Power integrity design for high speed circuit packages
In this talk, the fundamental concept for the power integrity (PI) design is first introduced, including the power distribution network (PDN) and its impedance, the mechanism of the power noise, and the design issues caused by the power noise. Several commercial solutions to suppress the noise, such as SMT capacitors, embedded capacitor, and on-chip capacitors, will be presented.