EMC - Joungho Kim - Power Integrity of SiP (System in Package)

In this talk, new modeling, design, and analysis approaches will be introduced with the consideration of power integrity. The unique methods are based on simultaneous and hierarchical chip-packaging, co-design and modeling in order to offer cost effective design solutions.
  • IEEE MemberUS $29.00
  • Society MemberUS $0.00
  • IEEE Student MemberUS $29.00
  • Non-IEEE MemberUS $39.00

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