Heterogeneous Integration Roadmap

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The 2019 Heterogeneous Integration Roadmap (HIR) is a roadmap to the future of electronics identifying technology requirements and potential solutions.

The primary objective is to stimulate pre-competitive collaboration among industry, academia and government to accelerate progress. The roadmap offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. Heterogeneous Integration refers to the integration of separately manufactured components into a higher level assembly (SiP) that, in the aggregate, provides enhanced functionality and improved operating characteristics. In this definition components should be taken to mean any unit whether individual die, MEMS device, passive component and assembled package or sub-system that are integrated into a single package. The operating characteristics should also be taken in its broadest meaning including characteristics such as system level performance and cost of ownership.

The 2019 Heterogeneous Integration Roadmap (HIR) is a roadmap to the future of electronics identifying technology requirements and potential solutions.

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