Heterogeneous Integration Platform for Next Generation Computing ('Beyond Moore')

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(24:08 + Q&A) Dr. Moonsoo Kang, Executive Vice President, Advanced Packaging Business, Device Solution Division, Samsung Electronics

Index:
-- Issues with Moore's Law: cost, performance, bandwidth
-- Chiplets: benefits
-- Samsung's roadmap: low-power; high bandwidth; very high performance
-- Various Samsung platforms and projections
-- Technical and phase-in issues
-- Becoming an HI platform for the industry

Appointed as the new head of the AVP (Advanced Packaging) Business unit in Dec. 2022, Executive Vice President Moonsoo Kang is responsible for the entire Advanced packaging business, including development and manufacturing in Samsung Device Solutions Division. Before his new role, Dr. Kang led the Business Development Team at Samsung Foundry BU, responsible for executing marketing strategies and technology planning since 2019. Prior to joining Samsung, he had taken several key positions within Physical Integration and Designing departments, contributing to his extensive experience in the semiconductor industry since 2005. He was also a professor of Physics at Washington State University, US in 2001 – 2005. His experience and insight of the industry has greatly contributed in founding new business for Advanced Packaging in Samsung.

For edited videos/slides for the plenary talks and working-group presentations, please visit our Silicon Valley EPS chapter's website: https://r6.ieee.org/scv-eps/?p=3049

(24:08 + Q&A) Dr. Moonsoo Kang, Executive Vice President, Advanced Packaging Business, Device Solution Division, Samsung Electronics

Index:
-- Issues with Moore's Law: cost, performance, bandwidth
-- Chiplets: benefits
-- Samsung's roadmap: low-power; high bandwidth; very high performance
-- Various Samsung platforms and projections
-- Technical and phase-in issues ....

Speakers in this video

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