Heterogeneous Integration Roadmap Update: Chapter on Photonics Packaging

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#reliability #photonics #electronics #advanced packaging #heterogeneous integration #roadmap

(26:09) - Prof. Amr Helmy, University of Toronto (and co-chair of the Photonics Technical Working Group)

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

To access the chapters in the Roadmap, please visit eps.ieee.org/hir

(26:09) - Prof. Amr Helmy, University of Toronto (and co-chair of the Photonics Technical Working Group)

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please ...

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