Heterogeneous Integration Roadmap Update: Chapter on Reliability

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#reliability #photonics #electronics #advanced packaging #heterogeneous integration #roadmap

(35:05 + Q&A) - Prof. Abhijit Dasgupta, University of Maryland (and chair of the Reliability TWG)

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

To access the chapters in the Roadmap, please visit eps.ieee.org/hir

(35:05 + Q&A) - Prof. Abhijit Dasgupta, University of Maryland (and chair of the Reliability TWG)

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

To access the chapters in the Roadmap, please visit eps.ieee.org/hir

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