Advanced Package Technologies and their Reliability Challenges

(28:07) Dr. Jason Zhang, Intel Corp.  Review: "This is an good overview of Intel's new heterogeneous integration packaging for their processor families, covering EMIB, Foveros, FoverosOmni, and FoverosDirect; materials, thermal management, advanced substrates, electrical/power performance, and yield."

Intel invented two disruptive technologies — the Embedded Multi-die Interconnect Bridge (EMIB) family and the Foveros family — which enabled higher I/Os/mm, higher signal integrity and low cost. This presentation details the two technologies, their challenges and solutions.

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