Panel: Enabling Hybrid Bonding Proliferation

35 views

Create Account or Sign In to post comments

#Hybrid bonding #advanced packaging #metrology #2.5D #3D #die stacking #Cu-Cu

(41:56) Panelists: Laura Mirkarimi, Adeia; Andrea Chacko, Brewer Science; Viorel Dragoi, EVG; Jonathan Abdilla, BESI; Jinho An, Applied Materials
From the First IEEE Hybrid Bonding Symposium

For other edited videos from this symposium, visit https://attend.ieee.org/hbs/?page_id=456

(41:56) Panelists: Laura Mirkarimi, Adeia; Andrea Chacko, Brewer Science; Viorel Dragoi, EVG; Jonathan Abdilla, BESI; Jinho An, Applied Materials
From the First IEEE Hybrid Bonding Symposium

For other edited videos from this symposium, visit https://attend.ieee.org/hbs/?page_id=456