Heterogeneous Integration, Group 2: Working Group Presentations, Discussion

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(1:13:23) Working Groups: 5G, RF and Analog Mixed Signal (Tim Lee, Boeing); Mobile (Bill Chen, ASE); Aerospace & Defense (Tim Lee, Boeing, and Benson Chan, SUNY-Binghamton); Materials & Emerging Research Materials (Bill Bottoms, 3MTS); and Cyber Security (Sohrab Aftabjahani, Intel).

(1:13:23) Working Groups: 5G, RF and Analog Mixed Signal (Tim Lee, Boeing); Mobile (Bill Chen, ASE); Aerospace & Defense (Tim Lee, Boeing, and Benson Chan, SUNY-Binghamton); Materials & Emerging Research Materials (Bill Bottoms, 3MTS); and Cyber Security (Sohrab Aftabjahani, Intel).

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