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(1:06:02) - Moderator: Tom Salmon, SEMI. Working Groups: Automotive (Veer Dhandapani, NXP); SiP and Module (Erik Jung, Fraunhofer IZM); MEMS and Sensors Integration (Mary-Ann Maher, softMEMS); Single Chip and Multi Chip Integration (Lei Shan, Ampere Computing); Integrated Power Electronics (Bob Connor, X-Beleprint); and Supply Chain (Kitty Pearsall, Boss Precision).
To access all the videos and slides from the 5th Heterogeneous Integration Symposium, held in Silicon Valley in February 2022, please visit https://r6.ieee.org/scv-eps/?p=2865
(1:06:02) - Moderator: Tom Salmon, SEMI. Working Groups: Automotive (Veer Dhandapani, NXP); SiP and Module (Erik Jung, Fraunhofer IZM); MEMS and Sensors Integration (Mary-Ann Maher, softMEMS); Single Chip and Multi Chip Integration (Lei Shan, Ampere Computing); Integrated Power Electronics (Bob Connor, X-Celeprint); and Supply Chain (Kitty Pearsall, Boss Precision).
