Quantum Computing: Wafer-Scale Superconducting Multi-Chip Module

51 views
Download
  • Share
Create Account or Sign In to post comments
#quantum computing #superconducting #multi-chip module #MCM

(16:52 + Q&A) Dr. Rabindra N. Das, MIT Lincoln Laboratory -- Presentation from 2023 Workshop on Quantum Computing: Devices, Cryogenic Electronics and Packaging (QC-DCEP) ...
Summary: Superconducting single-flux-quantum-based (SFQ) digital integrated circuits (ICs) are a promising candidate for a high speed and ultra-low energy dissipation computing system. Circuits based on several versions of SFQ-type logic, RQL (Reciprocal Quantum Logic), and AQFP( Adiabatic Quantum-Flux-Parametron) logic have been demonstrated with complexities reaching up to a few hundreds of thousands of gates. Packaging many superconducting ICs — and performing fast and nearly lossless operations between SFQ, RQL, AQFP, and CMOS -– is critical for a scalable computing architecture. In this talk, I will present a micro-bump based passive superconductive multi-chip module (SMCM) which distributes information between integrated circuits utilizing impedance controlled, lossless superconducting transmission lines.
This research was funded by the Intelligence Advanced Research Projects Activity (IARPA), and by the Assistant Secretary of Defense for Research & Engineering under Air Force Contract No. FA8702-15-D-0001. (The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of the IARPA, or the U.S. Government.)
Dr. Rabindra Das is a Member of the Technical Staff in the Quantum Information and Integrated Nanosystems Group, MIT Lincoln Laboratory, Lexington, MA. Prior to MIT, he was a Principal Engineer at Endicott Interconnect Technologies (formerly IBM Endicott). Dr. Das has 20 years of experience in microelectronics packaging development for applications ranging from HPC to medical to quantum electronics. He holds 48 patents and more than 100 publications.

Additional videos from the QC-DCEP Workhop can be accessed at https://attend.ieee.org/qc-dcep.

(16:52 + Q&A) Dr. Rabindra N. Das, MIT Lincoln Laboratory -- Presentation from 2023 Workshop on Quantum Computing: Devices, Cryogenic Electronics and Packaging (QC-DCEP) ...
Summary: Superconducting single-flux-quantum-based (SFQ) digital integrated circuits (ICs) are a promising candidate for a high speed and ultra-low energy dissipation computing system. Circuits based on several versions of SFQ-type logic, RQL (Reciprocal Quantum Logic), and AQFP( Adiabatic Quantum-Flux-Parametron) logic ...

Speakers in this video

Advertisment

Advertisment