Using Diamond in Advanced Packaging: Current Developments and Status

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#diamond #thermal performance #heat sinks

(56:50 + Q&A) -- artificial films, single-crystal wafers, properties, potential applications, 5G/6G, high density SiPs ...  Two Talks:
"Using Diamond Films to Enhance Thermal Performance in Electronics Packaging" — Joana Catarina Mendes, PhD, Instituto de Telecomunicações, Portugal; and
"Single-crystal Diamond Dies and Wafers for AI and Power Electronics Packaging" — Jeroen van Duren, PhD, Tech Applications VP, Diamond Foundry
Summary: Joana Mendes will present a detailed background on current status of diamond film development. Artificial diamond films are deposited from a mixture of methane and hydrogen — and the deposition of the material is not an expensive process. However, the integration of diamond films and electronic devices requires the development and optimization of new processing lines, which is a costly procedure. LEDs, for instance, have become low-cost components. Are manufacturers willing to trade the current low cost for higher efficiency/performance and longer lifetime? Specific upcoming possibilities are for HEMT packaging, 5G/6G RF modules in cell phones, and in heterogeneous integration such as for high-power SiP modules.
The second talk: Diamond Foundry, Inc. produces CVD single-crystal diamond (SCD) at scale, and recently achieved the historic milestone of the creation of the world’s first 100mm SCD wafer. SCD as heat spreader achieves performance enhancements of 3-6x and temperature reductions of 65C due to its unmatched high isotropic thermal conductivity (2,200W/m-K). Jeroen van Duren will describe the manufacturing of SCD dies and wafers and use for AI and power electronics packaging.

Bio: Dr. Joana Catarina Mendes graduated in Electronics and Telecommunication Engineering in 1998 from the University of Aveiro, Portugal, where she obtained her PhD in 2006. Mendes is currently a researcher at the Instituto de Telecomunicações in Portugal. She is working towards integrating artificial diamond with power electronic devices.

Bio: Dr. Jeroen van Duren is VP for Tech Applications at Diamond Foundry. He received his PhD in Chemical Engineering and Chemistry in 2004 at the University of Technology Eindhoven (Netherlands), and has been in Silicon Valley for the past 20 years working at and with leading companies in various industries (semiconductors, photovoltaics, display, metallurgy), and has published over 40 papers and filed numerous patents.

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(56:50 + Q&A) -- artificial films, single-crystal wafers, properties, potential applications, 5G/6G, high density SiPs ...  Two Talks:
"Using Diamond Films to Enhance Thermal Performance in Electronics Packaging" — Joana Catarina Mendes, PhD, Instituto de Telecomunicações, Portugal; and
"Single-crystal Diamond Dies and Wafers for AI and Power Electronics Packaging" — Jeroen van Duren, PhD, Tech Applications VP, Diamond Foundry
Summary: Joana Mendes will present a detailed background on current status of diamond film development. Artificial diamond films are deposited from a mixture of methane and hydrogen — and the deposition of the material is not an expensive process. However, the integration of diamond films and electronic devices requires the development and optimization of new processing lines ...

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