Thermal Sciences for the Heterogeneous Future

78 views
Download
  • Share
#thermal design #advanced packaging #heterogeneous integration #5G #photonics #3D integration #thermal #test #new materials #SiP #2.5D

Presentation from the 2021 IEEE Heterogeneous Integration Roadmap Symposium. This talk is by Prof. Kenneth Goodson, ME and Materials Sciences Departments, Stanford University.

The Fourth Annual Heterogeneous Integration Roadmap Symposium and Annual Meeting, held in Silicon Valley in February 2021, was sponsored by three IEEE Societies (EDS, EPS, and Photonics), as well as ASME and SEMI.

The HIR is 600+ pages of details across all areas of advanced electronics packaging, covering pre-competitive information for industry, working engineers, and academia.

The Roadmap is available without charge. Access videos at https://ieee-region6.org/scv-eps/?p=2416.

This presentation introduces the Roadmap and discusses the annual updates.

Presentation from the 2021 IEEE Heterogeneous Integration Roadmap Symposium. This talk is by Prof. Kenneth Goodson, ME and Materials Sciences Departments, Stanford University.

Speakers in this video

Advertisment

Advertisment