IMS MicroApps: Multi-Chip Module Design Challenges

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#IMS #IMS 2010 #International Microwave Symposium #Microwave #MultiChip #Module Design #Challenges #Dustin Hoekstra #AWR

IEEE.tv showcases the IEEE MTT International Microwave Symposium (IMS), held in Anaheim, California, May 23-28, 2010, the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as a full set of social events. The symposium also hosts a huge commercial exhibition, organized by MP Associates.

Dustin Hoekstra of AWR Corporation presents "Multi-Chip Module Design Challenges." As part of IMS 2010, MicroApps seminars from vendors of products and services in the microwave industry help microwave practitioners in learning the latest techniques, skills, and methods.

Dustin Hoekstra of AWR Corporation presents "Multi-Chip Module Design Challenges." As part of IMS 2010, MicroApps seminars from vendors of products and services in the microwave industry help microwave practitioners in learning the latest techniques, skills, and methods.

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