Interconnect Reliability: From the Chip to the System

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#reliability #photonics #electronics #advanced packaging #heterogeneous integration #interconnects

(37:22 + Q&A) - Dr. Dongkai Shangguan, Indium Corp.

Summary: Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. As newer forms of interconnects emerge to meet the demand for high density and high performance, interconnect reliability is becoming more complex and more critical. The growing adoption of heterogeneous integration leads to increased diversity of interconnects (with different geometries, materials, and interfaces) in the same package, with complex (and often interactive) reliability failure modes and mechanisms. Finer pitch interconnects in advanced packaging are more susceptible to failures due to electromigration, interfacial reactions etc. Cu direct bonding, without solder, presents new considerations in interconnect reliability. At the same time, as electronic products become more pervasive in application, interconnect reliability must be considered holistically with regard to environmental conditions, from mechanical, thermomechanical, to electrical and electrochemical. These considerations will impact reliability engineering for semiconductor devices, from design for reliability, to accelerated testing and analysis.
Yet another important dimension for interconnect reliability involves sustainability of electronic products, which demands environmentally friendly materials and processes, such as no-clean soldering, lead-free soldering, low temperature soldering, etc. Understanding of the failure mechanisms for different interconnect materials is of great importance to interconnect reliability, and ultimately reliability of semiconductor devices and electronic systems.
Dr. Dongkai Shangguan, IEEE Fellow & IMAPS Fellow, is currently an advisor to innovative companies in the global semiconductor and electronics industry. Previously, he served as Corporate Vice President at Flex (formerly Flextronics) and at STATSChipPAC (currently JCET). Early in his career, he held various technical and management responsibilities at Ford Electronics and Visteon.
Dr. Shangguan has published two books, authored/co-authored over 200 technical papers, and has been issued 28 U.S. patents. He has served on the iNEMI Board of Directors, the IEEE EPS Board of Governors, and the IPC Board of Directors. He has received a number of recognitions for his contributions to the industry, including the Outstanding Sustained Technical Contribution Award from IEEE EPS. Dr. Shangguan received his B.Sc. degree in Mechanical Engineering from Tsinghua University, China, MBA degree from San Jose State University, and Ph.D. in Materials from the University of Oxford, U.K. He conducted post-doctoral teaching and research at the University of Cambridge and The University of Alabama.

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

(37:22 + Q&A) - Dr. Dongkai Shangguan, Indium Corp.

Summary: Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. As newer forms of interconnects emerge to meet the demand for high density and high performance, interconnect reliability is becoming more complex and more critical. The growing adoption of heterogeneous integration leads to increased diversity of interconnects (with different geometries, materials, and interfaces) in the same package, with complex (and often interactive) reliability failure modes and mechanisms. Finer pitch interconnects ...

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