REPP: Making Digital Twins Work

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#reliability #photonics #electronics #advanced packaging #heterogeneous integration #digital twin

(1:02:33) Prof. G.Q. Zhang, Delft University of Technology, The Netherlands. 

ABSTRACT: Driven by the ever-increasing societal needs for digitization and intelligence, such as autonomous driving, Manufacture 4.0, “Smart-X”, and “AI in all”, the demands for mission-critical electronics components and systems are growing fast. To realize “performance and lifetime on demand” for those mission critical electronics, Digital Twin (DT) technology will play a more and more important role. DT consists of mainly 3 parts: physical products in real space, digital products in virtual space, and connections of data and information that tie the virtual and real product together. Starting from the definition of DT for mission-critical electronics, this talk will focus on the major success factors of developing a reliable virtual twin via multi-scale and multi-physics simulation and optimization, covering the whole product creation, qualification and application conditions. Some challenges for future developments will also be highlighted.
Dr. G.Q. Zhang is an IEEE Fellow, chair professor for Micro/Nanoelectronics System Integration and Reliability at Delft University of Technology (TUD). His research interests cover multi-level heterogeneous system integration and packaging; multi-physics and multiscale modeling and optimization of micro/nanoelectronics; digital twin and designing for reliability; wide-bandgap semiconductor sensors and components; SSL technology; and their applications mainly in healthcare, energy and mobility.
He chaired the Strategic Research Agenda of “More than Moore” for Europe’s technology platform for micro/nanoelectronics; served as co-chair of the academic council of the Dutch national innovation program “Point-One” on Micro/nanoelectronics and embedded systems; he was the founding person for MEMSLand, the NL national MEMS research consortium. Before becoming full-time professor at TUD, he worked for NXP Semiconductors as Senior Director of Technology Strategy until 2009, and Philips Research Fellow until May 2013. He was also a part-time professor at the Technical University of Eindhoven since 2001 and part-time professor of TUD since 2005. He is secretary-general of IEEE ITRW (International Technology Roadmap of Wide bandgap power semiconductors).

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'21), please visit our website and join our IEEE Dlist:

(1:02:33) Prof. G.Q. Zhang, Delft University of Technology, The Netherlands.  Overview of creation of Digital Twins for tracking and assessing the performance and reliability of electronics/photonics systems over their lifetimes, especially heterogeneously integrated systems using SiP packaging.