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In this presentation, we will discuss the fundamental design principles and challenges to achieve the low noise power distribution network, and the return current path by applying the concepts of the chip, package, and PCB PDN co-design.
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- IEEE Student MemberUS $29.00
- Non-IEEE MemberUS $39.00
Videos in this product
EMC - Li Er-Ping - Signal integrity and EMI in high speed electronics
In this presentation, we will discuss the fundamental design principles and challenges to achieve the low noise power distribution network, and the return current path by applying the concepts of the chip, package, and PCB PDN co-design.