Heterogeneous Packaging for Data Center Applications

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#REPP #electronics packaging #photonics packaging #heterogeneous packaging #data center

(23:45 + Q&A) Dr. Kevin Hu, MediaTek 

Bio: Dr. Kevin Hu is the head of MediaTek’s packaging organization, where he leads the company’s global efforts in packaging technology, package design, SI/PI, and PCB reference designs. Before joining MediaTek, Dr. Hu spent a decade at Apple, leading team that delivered breakthrough packaging innovations for some of the world’s most iconic consumer electronics. He also played a key role at Broadcom and Infineon, driving packaging solutions in Mobile, Connectivity, Networking and Power Electronics, which laid the foundation for several generations of cutting-edge technology products. Dr. Hu earned his Ph.D. in Mechanical Engineering from UCLA and is the inventor on more than 60 granted patents.

(23:45 + Q&A) Dr. Kevin Hu, MediaTek 

Bio: Dr. Kevin Hu is the head of MediaTek’s packaging organization, where he leads the company’s global efforts in packaging technology, package design, SI/PI, and PCB reference designs. Before joining MediaTek, Dr. Hu spent a decade at Apple, leading team that delivered breakthrough packaging innovations for some of the world’s most iconic consumer electronics...(more)

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