Strain and Surface Warping Detection of Interconnect Microstructures via Laser Diffraction

22 views

IEEE Reliability Society

IEEE Electronics Packaging Society

IEEE Electron Devices Society

IEEE Photonics Society

Create Account or Sign In to post comments

#moire #metrology #laser scanning #IC strain #electronics packaging #stress-strain

(27:40 + Q&A) Prof. Hongbin Yu, Arizona State University. Metrology for determining stress/strain in IC packaging as a result of thermal differential expansion, with fine detail across a chip or device.

Please visit our website and join our Dlist to access additional presentations on-demand from the Symposium on Reliability of Electronics and Photonics Packaging (REPP). attend.ieee.org/repp

(27:40 + Q&A) Prof. Hongbin Yu, Arizona State University. Metrology for determining stress/strain in IC packaging as a result of thermal differential expansion, with fine detail across a chip or device.

Speakers in this video

November 11, 2021

Next Up

00:55:57

Thermal Challenges and Opportunities: From Chip to Facility

00:55:57

Thermal Challenges and Opportunities: From Chip to Facility

00:02:25

IEEE Electronics Packaging Society: Designing the Future

00:55:57

Advancing Opto-Electronics With Thermo-Electric Technology

00:47:36

Advanced X-ray Imaging Technologies for Heterogeneous 3D IC Package Metrology and Inspection

00:47:36

Advanced X-ray Imaging Technologies for Heterogeneous 3D IC Package Metrology and Inspection