The Heterogeneous Integration Roadmap: Understanding Future Requirements in Advanced Packaging

(33:55) Paul Wesling, Hewlett-Packard (retired), IEEE Life Fellow and Distinguished Lecturer
Summary: The IEEE, with partners ASME and SEMI, has issued and updated a Heterogeneous Integration Roadmap that plots future directions within the broader semiconductor packaging field. It can be downloaded at no cost from the IEEE Electronics Packaging Society's website, at https://eps.ieee.org/hir.  The Roadmap provides focus on anticipated company directions and needed university research for our industry.  Divided into over 20 chapters, this pre-competitive document looks out 5 and 10 years to discern what technologies we expect to be made available for future products, and what developments our companies will find necessary to produce these new platforms and products.  In this talk, I discuss the six application areas being considered and the breadth of technologies that are expected to be applied, as well as technical and materials capabilities that are seen as being needed in coming years for power electronics, photonics, MEMS and sensors, RF/5G and other product areas.  Topics include substrates (polymer, Si, glass), interconnects (2.5D, 3D, TSV, WLP, EMIB) and processing (wire and hybrid bonding, additive manufacturing).  Far-reaching issues such as reliability, test, cybersecurity, and supply chains are discussed. 
Paul Wesling has been serving as editor for the HI Roadmap, working with each chapter’s Technical Working Group on its content and release.  He possesses broad general knowledge of the Roadmap organization and contents.  He received degrees in electrical engineering and materials science from Stanford University, then worked at Silicon Valley companies including Lenkurt Electric, Sperry-Univac, and Amdahl, joining Tandem Computers in Cupertino in 1985.  Paul retired from Hewlett Packard in 2001, then served as “Mr. IEEE” for the San Francisco Bay Area for 10 years.  He is a Life Fellow of the IEEE.  As vice president of publications for the IEEE Electronics Packaging Society for 22 years, he supervised four archival journals and a newsletter.  He received the IEEE’s Centennial Medal, the Board's Distinguished Service award, the Society Contribution Award, and the IEEE's Third Millennium Medal. 
Visit the HI Roadmap website (https://eps.ieee.org/hir) for updated information, or to assist in this effort.