Tutorial: Reliability Physics and Failure Mechanisms in Electronics Packaging

Advance to the tutorial module(s) you wish to view:
0:00 - Introduction to Modes and Acceleration (20:40: Q&A)
23:30 - Stress-Induced Failures (53:15: Q&A)
58:20 - Failure Analysis: Drop Test (1:10:10: Q&A)
1:12:50 - Moisture-Induced Reliability Issues (1:39:35: Q&A)
1:47:15 - Electromigration (2:11:40: Q&A)

Prof. Xuejun Fan, M.E. Department, Lamar University
-- stress conditions, thermo-mechanical, vibrational, moisture, humidity, electromigration, acceleration factors, applications ...

Summary: This course presents an overview of the physics of failures in electronics packaging. The course discusses key fundamental concepts of reliability physics associated with various stress conditions, including thermal degradation, thermo-mechanical stress, dynamic and vibrational loading, moisture and humidity, as well as electrical current stress. Failure mechanisms studied include chip-package interactions, micro-bump reliability, electromigration performance, inter-layer dielectric (ILD) damage under bumps and Cu pillars, solder joint reliability, drop and vibrational damage, interfacial delamination, and the impact of moisture and environmental humidity. Acceleration factor models for different failure mechanisms are introduced. Stress analysis methods using finite element analysis (FEA) with specific applications to packaging are described.

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