IEEE Heterogeneous Integration Roadmap: HIR 2020 Retrospective

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Presentation from the 2021 IEEE Heterogeneous Integration Roadmap Symposium. The HIR is 600+ pages of details across all areas of advanced electronics packaging, covering pre-competitive information for industry, working engineers, and academia.

The Fourth Annual Heterogeneous Integration Roadmap Symposium and Annual Meeting, held in Silicon Valley in February 2021, was sponsored by three IEEE Societies (EDS, EPS, and Photonics), as well as ASME and SEMI. The Roadmap is available without charge. Access videos at https://ieee-region6.org/scv-eps/?p=2416.

This presentation, by William (Bill) Chen of ASE, and co-chair of the Roadmap, introduces the Roadmap and discusses the annual updates.

Presentation from the 2021 IEEE Heterogeneous Integration Roadmap Symposium. The HIR is 600+ pages of details across all areas of advanced electronics packaging, covering pre-competitive information for industry, working engineers, and academia.

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