IEEE Heterogeneous Integration Roadmap Working Groups: Extended Q&A

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#advanced packaging #heterogeneous integration #5G #photonics #3D integration #thermal #test #new materials #SiP #2.5D

This post-Symposium session gave participants an opportunity to pose questions and engage in discussions.

The Fourth Annual Heterogeneous Integration Roadmap Symposium and Annual Meeting, held in Silicon Valley in February 2021, was sponsored by three IEEE Societies (EDS, EPS, and Photonics), as well as ASME and SEMI. The Roadmap is available without charge at https://eps.ieee.org/hir. Access videos at https://ieee-region6.org/scv-eps/?p=2416.

Question, Answer and Discussion session following the Heterogeneous Integration Roadmap Symposium. The HIR is 600+ pages of details across all areas of advanced electronics packaging, covering pre-competitive information for industry, working engineers, and academia.

Speakers in this video

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