Hybrid Bonding Process Technology

(27:33 + Q&A) Dr. Laura Mirkarimi and Dr. Guilian Gao, 3D Packaging, Adeia
From the First IEEE Hybrid Bonding Symposium
Summary: Hybrid bonding has emerged as the all-solid interconnect platform technology that powers performance gains through 1) revolutionizing manufacturing processes, 2) interconnect pitch scaling, and 3) enabling new levels of heterogeneous integration. The first wave of HVM adoption is mostly through wafer-to-wafer bonding. Many emerging advanced packaging applications, including chiplets, will be bonded in a die-to-wafer (D2W) format. Currently, the manufacturing capability is mostly captive in large ODMs. Participation of smaller foundries and OSAT in this market segment can accelerate wider adoption of the technology. As a pioneer of this technology, Adeia has accumulated experience over the past 20 years in developing key process technologies and integrating hybrid bonding with functional devices. As a technology development company, we have encountered and overcome many challenges that OSATS may encounter. We will share our experience in this presentation. The major areas of focus will be understanding the most critical processes, establishing the necessary metrology and sampling from the production line to ensure high yield repeatable processes.
Bio: Laura Mirkarimi is SVP of Engineering at Adeia Semiconductor, San Jose. She earned a PhD in Materials Science at Northwestern University and a B.S. in Ceramic Science & Eng. from Pennsylvania State University. Dr. Mirkarimi leads the 3D TechnologyTeam at Adeia and focusses on hybrid bonding, advanced packaging and thermal management technologies for future generations of electronic products.  She holds over 100 patents and has 60 technical publications. Prior to joining Adeia, she developed electronic devices including ferroelectric memory, transparent conductors and photonic crystal sensors at Hewlett Packard Laboratories for 12 years.  As VP of Electronics Segment Marketing at Zeiss Microsopy, she worked with the R&D and Product Manufacturing teams to build the product roadmap for x-ray microscopy. 
Bio: Guilian Gao received her Ph.D. in Materials Science from University of Cambridge, UK, Dr. Gao is an expert in hybrid bonding process technology. She has 35 years of experience in electronics packaging technology innovation, materials, processes, and reliability engineering. She is a Distinguished Engineer in 3D Technology at Adeia in San Jose, CA. Before joining Adeia, she was a Senior Technical Specialist at Ford Motor Co. She was honored with the Henry Ford Technology Award–the highest award for technical achievement in Ford Motor Company. Dr. Gao holds 90 US patents and more than 40 publications.

For other edited  videos from this symposium, visit https://attend.ieee.org/hbs/?page_id=456