High-resolution X-ray Computed Tomography (XCT) for Fault Isolation in Advanced Packaging

(45:55 + Q&A) Ehrenfried Zschech, deepXscan GmbH
-- nano-scale, failure analysis, micropores, microcracks, crack propagation, resolution ...

Advanced packaging of microelectronic products, especially 3D integration and hybrid bonding, provide challenges to process control and physical failure analysis as well as for the understanding of failure mechanisms. In this talk, the inherent advantages of non-destructive X-ray computed tomography (XCT) in the sub-micron and nano range are demonstrated for fault isolation and for the understanding of the evolution of reliability-limiting defects in packaged microchips. Sub-micron and nano-XCT enable the representation of structures and defects (e.g. micropores and microcracks) in advanced packaging and interconnect structures. Another unique advantage of XCT — as opposed to destructive FA methods — is that kinetic processes such as crack propagation, which can lead to degradation and ultimately failure of microelectronic components, can be imaged with high resolution.

Bio: Ehrenfried Zschech is CTO and co-founder of deepXscan GmbH, Dresden, Germany. His responsibilities include research and innovation in the field of high-resolution X-ray imaging and the development of customized solutions for a broad range of applications including advanced packaging for microelectronics. He is member of the European Academy of Science (EurASc) and of ACATECH Germany. He had several management positions at Airbus in Bremen, at Advanced Micro Devices in Dresden and at Fraunhofer. He holds honorary professorships for Nanomaterials at Brandenburg University of Technology Cottbus-Senftenberg and for Nanoanalysis at Dresden University of Technology. Ehrenfried Zschech was awarded with the FEMS European Materials Gold Medal in 2019.

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