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01:19:53
The Origins of Silicon Valley: Characteristics of a Startup Environment
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Showing 23 - 44 of 163
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Packaging Challenges in Quantum Computing
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High-Bandwidth and Low-Latency Standardized Interconnect for an Open Chiplet Ecosystem
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Heterogeneous Integration Platform for Next Generation Computing ('Beyond Moore')
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Basic Research in Microelectronics
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Introduction: Sixth Annual Symposium on Heterogeneous Integration
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Update on the CHIPS Research and Development Programs
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Submicron Nanosecond Thermoreflectance Imaging for Thermal and Failure Analysis
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Tutorial: Reliability Testing and Design for Reliability of Packaging Interconnects
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Challenges and Recent Perspectives of 3D Heterogeneous Integration
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Thermal and Failure Analysis of Advanced Microelectronic Devices
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Interconnect Reliability: From the Chip to the System
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Mars 2020 Perseverance Rover: Thermal Cycle Life Qualification
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