(07:36) - 5th Heterogeneous Integration Symposium - intro, 3-day profile, Symposium speakers, Technology working groups (TWGs), feedback, acknowledgments.

To…

(37:22 + Q&A) - Dr. Dongkai Shangguan, Indium Corp.

Summary: Interconnect reliability is critical to the reliability of semiconductor packaging and…

Produced and Edited by Stephen Esker, IEEE.tv

2023 CES in Las Vegas, NV IEEE President and CEO, Saifur Rahman experienced many exciting innovations firsthand at this years event while…

One of the fastest growing fields, Biomedical Engineering is known to be the engineering field of the future. This video describes a variety of different career opportunities within the field, and…

In this video, Computational Intelligence Society (CIS) member Jim Keller is interviewed by Jim Bezdek. The only question is: Who will goof off more?

(49:10 +Q&A) Dr. Tiwei Wei, Assistant Professor, School of Mechanical Engineering, Purdue University
Summary: Advanced semiconductor packaging is…

Webinar information:

Webinar Speaker: Dr. Daniela López De Luise
Webinar Chair: Dr. Sansanee Auephanwiriyakul
Webinar Title: Let us measure STEAM
Date and Time:…

(56:50 + Q&A) -- artificial films, single-crystal wafers, properties, potential applications, 5G/6G, high density SiPs ...  Two Talks:
"Using Diamond Films to Enhance…

(38:48 + Q&A) Masoud Babaie, Associate Professor, Delft University of Technology -- Presentation from 2023 Workshop on Quantum Computing: Devices, Cryogenic Electronics…

Ken Salisbury discusses his career and work in robotics. Outlining his movement from academia to industry and back to academia, he describes his involvement in robotics projects, such as the…

Glenn Zorpette, IEEE Spectrum, interviews Frank Kschischang, awarded the IEEE Richard W. Hamming Medal “For contributions to the theory and practice of error…

(28:07) Dr. Jason Zhang, Intel Corp.  Review: "This is an good overview of Intel's new heterogeneous integration packaging for their processor families, covering EMIB…

(47:16 + Q&A) Herman Oprins, Principal MTS & R&D Team Leader, imec  -- heterogeneous system scaling, logic+memory+optical, backside power, thermal design,…

Welcome & introduction by Jan Budroweit at the 2023 IEEE LEO SatS Workshop on Space Edge Computing & Onboard AI.

(19:50 + Q&A) - Parnika Gupta, Tyndall National Institute

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics…

RAS Member Hirochika Inoue explains what drew him into the field of robotics and automation.

HPC (high performance computing) has come a long way from simple weapons design/weather forecasting to now advanced design & predictions about many phenomena. A lot of this became possible…

AI Techniques for Massive Satellite Networks presentation by Akram Al-Hourani at the 2023 IEEE LEO SatS Workshop on Space Edge Computing & Onboard AI.

(37:36) - Andrew Tay, National University of Singapore

Summary: Detecting sub-micron time-dependent thermal defects and identifying those that represent…

Interview with Computational Intelligence Society (CIS) member and hat enthusiast Jim Bezdek, from 2016. Interview by Jim Keller.

How to create an @ieee.org email address using your IEEE Account:
 
Step 1. Visit…

This video guides authors on how to publish in an IEEE conference.

Local Groups are a new IEEE concept. They are a low overhead, agile, and efficient way for a Section...

Future 5G/6G mobile communication systems are expected to integrate various radio access technologies, including the satellite component. In this framework, terrestrial services can be augmented…